Black Epoxy Resin Encapsulant | Solder Material Supplier

Black Epoxy Potting Compounds, JF-121AB

Features

This black epoxy resin encapsulant offers low viscosity and good flowability, making it easy to penetrate into gaps in the product.
It can cure at room temperature or moderate temperatures, with a moderate curing speed.
Cured material has a smooth surface, no bubbles, and a high gloss with high hardness.
The cured material has good resistance to acids and alkalis, excellent moisture, water, oil, and dust resistance, as well as resistance to humidity, heat, and atmospheric aging.
The cured material exhibits excellent electrical and physical properties, including good insulation, compressive strength, and high bonding strength.

Application

Potting, sealing, and encapsulating of electronic or other products requiring protection against moisture.
Potting transformers, buzzers, atomizers, negative ion generators, aquarium water pumps, ignition coils, power modules, electronic controllers, and other electronic components.
This black flame retardant epoxy potting adhesive is not suitable for potting products with elastic or soft shells.

Technical Parameters

Appearance and Physical Properties

Model	121A	121B
Color	Black viscous liquid	Brown liquid
Specific Gravity at 25℃	1.50g/cm³	1.05g/ cm³
Viscosity at 25℃	3600-3900cps	280-360cps
Shelf Life at 25℃	6 months	6 months
Mix Ratio (Weight)	A:B=100:20
Useable Life	30min (25℃, 100g mixture)
Cure Time	8-10 hours (room temperature) or 1.5 hours (60℃)

Cured System

Dielectric Constant	1KHZ	3.75
Dielectric Loss	1KHZ	0.02
Compressive Strength	kg/mm²	24
Bending Strength	kg/ mm²	11
Tensile Strength	kg/ mm²	16.5
Impact Strength	kg/ mm²/cm²	8.5
Dielectric Constant	1KHZ	3.8~4.2
Hardness	SHORE D	80
Thermal Deformation Temperature	℃	80
Volume Resistivity at 25℃	Ohm-cm	1.35x1015
Surface Resistivity at 25℃	Ohm	1.2x1014
Voltage Withstand at 25℃	Kv/mm	16~18

Packaging:

The packaging specification is 30kg per set, which includes 25kg/barrel of the main agent and 5kg/barrel of the curing agent.