Clear silicone potting compound is a two-component, room temperature curing organic silicone potting adhesive, consisting of two liquid parts A and B. After mixing A and B components in a ratio of 10:1 (by weight), it cures through a condensation reaction to form a high-performance elastic material. The compound has good flowability, high bonding strength, and excellent properties such as aging resistance and temperature resistance.
Application
The curing speed of this product is adjustable and can achieve deep curing, with good protection and insulation performance. It is used for fixing and insulating electronic components, moisture-proof and waterproofing of integrated circuits boards and light emitting devices, as well as coating and casting of large-area bonding seals. It is mainly used in outdoor lighting fixtures and harsh environments that require moisture resistance, corrosion resistance, and shock absorption.
Technical Parameters
Liquid Properties
Item
Stand
Part A
Part B
Appearance
GB/T 10247-2008
Clear liquid
Clear liquid
Viscosity (cps,25℃)
GB/T 15223- 1994
1500-2000
50-100
Gravity (g/cm3)
Weight
1.0-1.12
0.98-1.02
Mix Ratio
GB/T 10247-2008
A:B=10:1
Mixed System Viscosity (cps,25℃)
GB/T 10247-2008
1000-1500
Useable Life (25℃)
GB/T 10247-2008
40-60 mins
Gel Time (25℃)
GB/T 10247-2008
1-2 hours
Cure Time (25℃)
GB/T 10247-2008
24 hours
Cured System
Item
Stand
Part A
Part B
Appearance
Visual Inspection
Clear elastomer
Hardness (ShoreA,24hr)
GB/T 531-2008
18-25
Tensile Strength (MPa)
GB/T 531-2008
≥0.5
Shear Strength (MPa)
GB/T 528-2009
1.2
Dielectric Strength (kV/mm)
GB/T 7124-2008
≥15
Volume Resistivity (Ω.CM)
GB/T 1695-2005
1.0 x 1013
Dielectric Constant (60Hz)
GB/T 1693-2007
3.5
Elongation At Break (%)
GB/T 1693-2007
160-180
Temperature Range (℃)
GBT 20028-2005
-60-200
Shrinkage (%)
GB/T 15585-1995
0.02
Packaging:
The packaging specification is 22kg per set, which includes 20kg (in barrel) of component A and 2kg (in pot) of component B.
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