Transparent Electronic Potting Compound, JF-212A225B

Clear epoxy resin encapsulant is an environmentally friendly epoxy resin adhesive that can be cured at room temperature or moderate temperature, with a moderate curing speed. The cured material has excellent transparency, smooth and glossy surface, no bubbles, moderate hardness, and strong adhesion, as well as good solvent resistance and moisture/waterproof performance.

It is suitable for transparent encapsulation of LED lamp modules, electronic transformers, power module assemblies, sensors, high-voltage packages, electronic component resistors, electronic triggers, and various equipment requiring moisture-proof, waterproof, and high-temperature resistance protection.