Our Solder Powder can be often found in the LED circuit boards, assorted lighting fixtures, computer mainboard, mobile phone motherboards, sundry precise circuit boards, printed circuit boards, SMT components, as well as the plug-in boards. It is a first choice of repairing the mini-sized electronic instruments. In addition, the tin powder is an indispensable material for producing the solder paste.
Our solder powder is a kind of grey or grayish-white solid powder with its particle size from 2µm to 75µm. Each bag can hold the product of 5kg weight. The diameter of our solder ball ranges from 2cm to 3cm, and the tin hemisphere is also available. Our ball should be kept in cold storage at the temperature range from zero to 10℃. It can reach the optimal state at the temperature range from 5℃ to 7℃.
We also have developed Low Alpha Solder Powder, for high performance semiconductor devices that require low alpha packaging solutions.
Uses
The Solder Powder are primarily used for the manufacturing of the electrical carbon products, friction materials, oil bearings, and the powder metallurgy materials. Our product comes with various models, including Sn63Pb37, Sn62Pb36Ag2, Sn96.5Ag3.0Cu0.5, Sn42Bi58, Sn64Bi35Ag1, and more. Moreover, the pure tin anode rod made by our company is fit for use in the electroplating industry.
High Reliability
Our Solder Powder have not only passed the SGS test, but also achieved RoHS, REACH, and other certifications. Moreover, this product is provided with the related material safety data sheet, abbreviated as MSDS. Our lead-free tin powder has been exported to Egypt, Russia, Lithuania, Poland, and other countries. In addition, we are searching for more agents around the world. Welcome to consult us, if you show interest in our solder products.
Low Alpha Solder Powder Due to the soft errors and upsets from alpha particle emissions in electronic devices from solders, the packaging for high-density, miniaturized device such as SiP system and flip chip require low alpha packaging solutions.
Tin-Copper Alloy Solder Powder Utilizing advanced international techniques, such as high-speed centrifugal atomization and ultrasonic atomization, this spherical tin-based solder powder is produced with consistent particle size and low oxygen content. These characteristics improve the solder paste’s spreading and wetting properties, ensuring reliable and even solder joints.
Standard Paste Composition
Application Characteristic
IPC Alloyed Powder Type
Size of Alloyed Powder
Content of Alloyed Powder
Standard Printing
No.3 powder
25~45μm
89%
Fine-Pitch Printing
No.4 powder
20~38μm
88.50%
Instillation
No.3 powder
25~45μm
85%
Standard printing
No.6 powder
5-15um
89%
Standard printing
No.7 powder
2-11um
89%
Standard printing
No.8 powder
6-2um
89%
Standard printing
No.9 powder
4-1um
89%
Packing
Packing Specification
5kg/bag, 4 bags/box
Packing Material
The inner layer is a plastic bag, and the outer layer is a hard plastic box. These two layers are adopted to guarantee the safety of transportation.
Dimension of Carton (Length*Width*Height)
18.5*18.5*18.5cm
G.W.
20kg
MOQ
50kg
Production Capacity
We can supply 80 tons of solder powder each month.
Others
We can track your order 24 hours a day, and inform you of the production process in time.
Related Names
Alloy Soldering Powder | Tin Powder | Soldering Tin Ball
Solder Wire, Solder Bar, Solder Paste Manufacturer
The demand for lead-free solder has increased dramatically since the 2006 restriction came into effect for intentionally leaded consumer electronics. As a dedicated OEM manufacturer, JUFENG can provide lead-free solder wires with a diameter of 0.1mm or greater. Our massive inventory also includes a premium selection of solder ball, flux, paste, and powder.
