Flame Retardant and Thermally Conductive Electronic Potting Glue , JF-124AB
Flame Retardant and Thermally Conductive Electronic Potting Glue , JF-124AB
Flame retardant thermally conductive epoxy resin is a two-component adhesive used for potting applications. It is specifically designed to provide flame retardancy and thermal conductivity. This epoxy resin can cure at room temperature or moderate temperatures, offering a moderate curing speed. It has excellent flowability, allowing it to easily penetrate into small gaps and voids in the product. After curing, it has a smooth surface, no bubbles, high hardness, not shrinkage, excellent insulation, thermal conductivity, heat dissipation, and flame retardant properties. It is also waterproof, moisture-proof, dust-proof, and leakage-proof. It has strong weather resistance and good impact resistance. The color can be adjusted according to customer requirements.
Application
Potting and encapsulating aquarium water pumps, transformers, sensors, buzzers, atomizers, ion generators, ignition coils, power modules, electronic controllers, and other electronic components.
It is suitable for potting, encapsulation protection, and insulation against moisture for electronic or other products.
Technical Parameters
Appearance and Physical Properties
Model
124A
124B
Color
Black Liquid
Clear Liquid
Specific Gravity at 25℃
1.40±0.1g/cm3
1.05±0.1g/ cm3
Viscosity at 25℃
10000-13000cps
50-100cps
Mix Ratio (Weight)
5:1
Useable Life
60 min (25℃, 100g)
Cure Time
12 hours (25℃) or 2 hours (80℃)
Cured System
Hardness
Shore D
80
Bending strength
Kg/ mm2
12-14
Tensile Strength
Kg/ mm2
10-12
Compressive Strength
Kg/ mm2
22-24
Water Absorption at 25℃
%24 hours
< 0.15
Thermal Conductivity
W/(m·K)
0.8
Dielectric Constant
1KHZ
3.8-4.2
Volume Resistivity at 25℃
Ohm.cm
≥1.0x1015
Surface Resistivity at 25℃
Ohm
≥1.0x1014
Voltage Withstand at 25℃
Kv/mm
16-18
Coefficient of Thermal Expansion
m/℃
Packaging:
The packaging specification is 30kg per set, which includes 25kg/barrel of the main agent and 5kg/barrel of the curing agent.
Solder Wire, Solder Bar, Solder Paste Manufacturer
The demand for lead-free solder has increased dramatically since the 2006 restriction came into effect for intentionally leaded consumer electronics. As a dedicated OEM manufacturer, JUFENG can provide lead-free solder wires with a diameter of 0.1mm or greater. Our massive inventory also includes a premium selection of solder ball, flux, paste, and powder.
