Low Alpha Solder Powder
Due to the soft errors and upsets from alpha particle emissions in electronic devices from solders, the packaging for high-density, miniaturized device such as SiP system and flip chip require low alpha packaging solutions.
Based on this, we have developed a new product, Jufeng low alpha solder powder, for high performance semiconductor devices that require low alpha packaging solutions.
Our low alpha solder powder is used in mobile communications (smartphones, tablets, wearables), Internet of Things (Wi-Fi, BLTE, UWB, LTE-M & NB-IoT, consumer, industrial), automotive (infotainment systems), high performance computing (computing, networking, artificial intelligence), etc.
We offer two radioactive grades of low alpha solder: low alpha (<0.01 cph/cm2) and ultra low alpha (<0.002 cph/cm2). The solder materials can be lead free, high lead alloy with particle sizes covering T3, T4, T5, and T6.
Our low alpha solder material meets the requirements of alpha particle emission specifications and has the advantages of high tin powder sphericity, narrow particle size distribution, low oxygen content, and high chemical purity. We also offer customization services.