Tin-Copper Alloy Solder Powder
Technical Details
Utilizing advanced international techniques, such as high-speed centrifugal atomization and ultrasonic atomization, this spherical tin-based solder powder is produced with consistent particle size and low oxygen content. These characteristics improve the solder paste’s spreading and wetting properties, ensuring reliable and even solder joints. The powder's compatibility with various soldering methods and fluxes makes it suitable for a wide range of applications, from electronics assembly to industrial metal bonding.
Applications
This solder powder is primarily used in the electronics industry for surface-mount solder paste, as well as in metal bonding and powder metallurgy manufacturing. Its versatility allows it to meet the demands of high-precision industries, ensuring strong and reliable connections in various electronic components and metalworking processes.
Alloy Composition and Impurity Content (%)
| Main Components | Impurities |
| Sn | Cu | Pb | Ag | Bi | Al | Sb | Fe | As | Cd | Zn |
| ≥96.686 | 3±0.5 | ≤0.05 | ≤0.03 | ≤0.05 | ≤0.03 | 0.1 | 0.02 | 0.03 | 0.002 | 0.002 |
Product Packaging
- Packaging Size: 25Kg per bin
- Inner packaging: Vacuum-sealed aluminum foil bags filled with nitrogen (N2) to maintain product integrity, with each bag containing 5Kg. An antioxidant is included in each bag for additional protection
External Packaging:
The solder powder is stored in plastic bins, with each bin containing 5 bags of 5Kg each
Storage Instructions
This alloy solder powder should be stored at temperatures below 30°C and humidity levels below 80% to maintain its quality. Under these conditions, the soldering powder has a shelf life of up to 6 months
