The solder preforms are used in a variety of applications such as:
Die attach of semiconductor, LED and laser chips, thermal fuses, sealing, thermal interface, connectors and cables, vacuum and hermetic seals and gaskets, PCB assembly, mechanical attachment, package/lid sealing.
Solder preforms are used in conjunction with solder paste to precisely increase the amount of solder.
Solder preforms gaskets eliminate the need for secondary soldering processes.
SMT solder preforms with carrier tape packaging, simple operation and improved economic efficiency
Application of solder preforms
IGBT Module package
Power switching transistor package
Thick film circuit package
Management system: ISO 9001, IATF16949
Uses high purity raw material (Tin - 5N, gold and silver - 4N )
Has strict control on using times of raw materials
Composition and melting point testing must be performed on each batch of products.
Random inspection according to the standards of GB/T2828S-3
100% appearance inspection
Performance inspection: oxidation, ductility, soldering
Performs strict quality control on the sample, the first finished product and final product.
Solder Wire, Solder Bar, Solder Paste Manufacturer
The demand for lead-free solder has increased dramatically since the 2006 restriction came into effect for intentionally leaded consumer electronics. As a dedicated OEM manufacturer, JUFENG can provide lead-free solder wires with a diameter of 0.1mm or greater. Our massive inventory also includes a premium selection of solder ball, flux, paste, and powder.