Sn50Pb50 Tin Lead Solid Solder Wire and Solder Bar

Our Sn50Pb50 tin lead solid solder wire and solder bar possesses the melting point of approximately 200 degrees Celsius and the working temperature of 250 degrees Celsius. Sn50Pb50 means that the alloy of soldering wire consists of the 50% tin content and the 50% lead content. The diameter of our product varies from 0.35mm to 3.0mm. Formulated by utilizing high technology, the activated flux is used as the rosin flux in tin wire.

Our company is a Chinese manufacturer, which basically researches and produces the lead-free solder wire, solder bar and solder paste, as well as the flux materials for soldering printed circuit boards. We own over a decade of manufacturing experience. At present, we hold the most advanced production equipment and test instruments within this industry. Our company has passed the ISO9002 quality system certification, and our products can offer stable performance. For better meeting the requirements for diversified soldering processes, the solder made by our factory can be divided into various shapes, including the strip, wire, block, plate, ball, and more.

Applications
The Sn50Pb50 tin lead solid solder wire and solder bar can be used for the soldering of stainless steel, zinc alloy, aluminum lamp cap, and some others in the automotive and electronics industries. This type of product is particularly suitable for the manual welding work, component installation, surface mount technology, as well as the repair welding process.

• Fast Melting Speed, Superb Wettability and Terrific Expandability
  The tin wire is added with the no-clean activated rosin flux, featuring fast melting speed, superb wettability and terrific expandability. Thereby, it can offer distinguished soldering effect.
• Wonderful Electrical Conductivity, No Core Breakage, and No Splash
• High Melting Point
  This Sn50Pb50 tin lead solid solder wire is formed by tin and lead. The leaded tin wire manufactured is characterized by high melting point, superb softness and nice wetting property.
• Satisfactory Solder Joint and Favorable Fluidity
  Our solder joints are filled, bright and firm. Both RMA and RA cores are made in compliance with the IPC J-STD-006 and JIS Z 3283 Class AA/ Class A standards. All these solder fluxes can be dissolved in solvent, featuring very little smoke and very few splatters.
• Flux Content
  The flux content ranges from 1.2% to 3.5%. For the vast majority of applications, the flux content is recommended to range from 1.8% to 2.0%. The wire diameter is optional, including 0.35, 0.4, 0.5, 0.6, 0.8, 1.0, 1.2, and 1.6mm.

Related Names
Soldering Tin Plate | China Solder Rod | Soft Soldering Materials