JF-800920 high-lead solder paste is made of high-reliability soldering flux and high-quality Sn5/Pb92.5/Ag2.5 alloy powder with high sphericity, uniform particle distribution, and low oxide content.
The high-reliability soldering flux of this solder paste is compounded of polymer film forming agent, modified resin, organic activator and polymer alcohol ether solvent. Besides, High lead, high melting point alloys that comply with RoHS exemption regulations are used.
Our high-lead solder paste usually applies to power semiconductor and other components packaging and welding. The alloy has good compatibility with gold, copper and silver with high welding strength and residual impedance. This solder paste features good printing fluidity and good solderability, less residual after welding, and high insulation resistance.
Excellent wetting performance, suitable for different metal plating of solder pad
Great voiding performance
Easy to clean residue system
Excellent operation stability
JF-800920 solder paste meets the requirements of automatic dispensing process, can be used for high-temperature working devices, high-density integrated circuit packaging and welding of circuit boards requiring 2nd reflow. For example, it has good application effects in the fields of hybrid integrated circuits, semiconductor integrated circuits, filter devices, microwave devices, high-power devices, connectors, sensors, metal or ceramic enclosures of photoelectric devices and other special electronic components such as metal enclosures or ceramic enclosures.
Solder Wire, Solder Bar, Solder Paste Manufacturer
The demand for lead-free solder has increased dramatically since the 2006 restriction came into effect for intentionally leaded consumer electronics. As a dedicated OEM manufacturer, JUFENG can provide lead-free solder wires with a diameter of 0.1mm or greater. Our massive inventory also includes a premium selection of solder ball, flux, paste, and powder.