Sn5/Pb92.5/Ag2.5 High-Lead Solder Paste

JF-800920 high-lead solder paste is made of high-reliability soldering flux and high-quality Sn5/Pb92.5/Ag2.5 alloy powder with high sphericity, uniform particle distribution, and low oxide content.

The high-reliability soldering flux of this solder paste is compounded of polymer film forming agent, modified resin, organic activator and polymer alcohol ether solvent. Besides, High lead, high melting point alloys that comply with RoHS exemption regulations are used.

Our high-lead solder paste usually applies to power semiconductor and other components packaging and welding. The alloy has good compatibility with gold, copper and silver with high welding strength and residual impedance. This solder paste features good printing fluidity and good solderability, less residual after welding, and high insulation resistance.

• Excellent wetting performance, suitable for different metal plating of solder pad
• Great voiding performance
• Easy to clean residue system
• Excellent operation stability

JF-800920 solder paste meets the requirements of automatic dispensing process, can be used for high-temperature working devices, high-density integrated circuit packaging and welding of circuit boards requiring 2nd reflow. For example, it has good application effects in the fields of hybrid integrated circuits, semiconductor integrated circuits, filter devices, microwave devices, high-power devices, connectors, sensors, metal or ceramic enclosures of photoelectric devices and other special electronic components such as metal enclosures or ceramic enclosures.