Our Sn30Pb70 tin lead solder wire and solder bar pertains to a kind of high-temperature leaded solder wire with its melting temperature of 225 degrees Celsius and the operating temperature of 280 degrees Celsius. Its alloy is composed of the 30% tin content and the 70% lead content, and its diameter ranges from 0.35mm to 3.0mm.
This series of rosin-cored solder wire adopts the newest type of activated rosin flux, which is produced in use of the most advanced automated equipment. Then, it can be adapted to the complexity and high precision of the development of the electronics industry.
The Sn30Pb70 tin lead solder wire and solder bar is provided with uniform surface, extremely high purity, superb fluidity, wonderful wetting property, and a rare occurrence of oxidizing slag. It is fit for the manual welding process which has high demand.
Furthermore, this product is highly resistant to oxidation. It can provide the mirror-like surface, short wetting time, and relatively high expansion rate at below 300 degrees Celsius. Its solder joint is glossy and nice, which allows our product to be desirable for the spot welding of PCB parts.
With no-clean activated rosin flux, the solder wire possesses high melting speed, as well as outstanding wettability and expandability. Thus, it can offer distinguished soldering effect.
Beyond that, our Sn30Pb70 tin lead solder wire and solder bar is provided with superior electrical conductivity. It does not produce any odor, splatter or core breakage. Its solder joint is full, firm and highly reliable.
The leaded solder wire manufactured possesses high melting point.
Tin Zinc Solder Wire | Brazing Alloy | Selective Soldering Materials
Solder Wire, Solder Bar, Solder Paste Manufacturer
The demand for lead-free solder has increased dramatically since the 2006 restriction came into effect for intentionally leaded consumer electronics. As a dedicated OEM manufacturer, JUFENG can provide lead-free solder wires with a diameter of 0.1mm or greater. Our massive inventory also includes a premium selection of solder ball, flux, paste, and powder.